Wafer Grinding

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Semiconductor Wafer Grinders

Semiconductors are called "the rice of industry.” They are indispensable products in modern society. Our grinders play an important role in the semiconductor manufacturing process.

Manufacturing Process

Wafer Manufacturing Process

The general term for a semiconductor integrated circuit (IC) that is protected from external factors and electrically connected (packaged) is called “semiconductor chip.” The semiconductor chip manufacturing process can be divided into three steps.

①Process for manufacturing wafers (wafer manufacturing process)
② Process for cleaning wafers and performing chemical treatment (front-end process)
③Process of dividing wafers into chips and packaging them (back-end process)

Our grinders are used in the wafer surface grinding (polishing) process of wafer manufacturing.

Wafer Manufacturing Process

Hard and Brittle Wafers Grinder

What is "Hard and Brittle Wafer"?

What is

Hard and brittle materials are characterized by their high hardness and brittleness.
Introducing the best machines for grinding hard and brittle wafers (SiC, GaN, LN, etc.) used in semiconductors.

Hard and Brittle Wafers Grinder

Silicon Wafer Grinder

What is "Silicon Wafer"?

What is

This material is the “heart” of electronic components that use semiconductors. Silicon is an excellent semiconductor material and its purity and quality significantly influence the performance of electronic devices.

Silicon Wafer Grinder

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