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Semiconductor Wafer Grinders
Semiconductors are called "the rice of industry.” They are indispensable products in modern society. Our grinders play an important role in the semiconductor manufacturing process.
Manufacturing Process
Wafer Manufacturing Process
The general term for a semiconductor integrated circuit (IC) that is protected from external factors and electrically connected (packaged) is called “semiconductor chip.” The semiconductor chip manufacturing process can be divided into three steps.
①Process for manufacturing wafers (wafer manufacturing process)
② Process for cleaning wafers and performing chemical treatment (front-end process)
③Process of dividing wafers into chips and packaging them (back-end process)
Our grinders are used in the wafer surface grinding (polishing) process of wafer manufacturing.
Hard and Brittle Wafers Grinder
What is "Hard and Brittle Wafer"?
Hard and brittle materials are characterized by their high hardness and brittleness.
Introducing the best machines for grinding hard and brittle wafers (SiC, GaN, LN, etc.) used in semiconductors.
Hard and Brittle Wafers Grinder
Silicon Wafer Grinder
What is "Silicon Wafer"?
This material is the “heart” of electronic components that use semiconductors. Silicon is an excellent semiconductor material and its purity and quality significantly influence the performance of electronic devices.