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New Product Information
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SiC Wafer Grinder R631BM
8 inch SiC wafer compatible!!
Product Specifications
Equipped with a jointly developed G.W. “nanoVi” with
JTEKT GRINDING TOOLS CORPORATION,
it will realizes low G.W. wear rate.
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Wide Wheel Cylindrical Grinder C6040E
Space saving for productivity!!
Product Specifications
Simultaneous grinding of all outer face.
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Vertical Multi-Head Grinder G3VU86
Vertical Multi-Head Grinder in basic class can grind a workpiece length of 600mm.
And the program is "interactive"as standard.
Product Specifications
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Ultra Compact Centerless Grinder C1003
Small parts in a small machine!
Find out more about C1003
Auxiliary equipment such as a coolant tank is all-in-one inside the machine.
Center dressing system allows fully automatic dressing of the grinding wheel, regulating wheel and automatic center height setting. One-touch fine adjustment by NC blade up/down mechanism. Same grinding wheel for outer diameter end-face. Continuous grinding is possible by connecting with "Ultra Compact Surface Grinder R011". -
Centerless Grinder C6060
Wheel peripheral speed of 80m/sec. high-speed, high-precision grinding with CBN and thermal displacement control. Greatly reduced dressing time, significantly reduced wheel replacement time and blade replacement time.
Find out more about C6060 -
Vertical Spindle Type Grinder VGF300
Modular of grinding units. "Multi-surface continuous grinding line" by connecting VGF300 of different grinding units. Equipped with a wire transfer robot as standard.
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Double Disc Grinder (Vertical Spindle) KVD350
High rigidity with a BOX structure bed - Reduction of thermal displacement by thermal rigidity. Flat flow channel and large drainage opening to prevent sludge accumulation. The "Metal bonded grinding wheel" and "High rigidity due to the BOX structure bed" are effective in grinding ultra-hard materials. Wheel replacement - Maintenance can be done through the side door of the machine.
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ID Grinder KIH80 Ⅱ
High precision, high speed grinding and small footprint bearing internal grinder. Depending on the machining specifications, the workhead can be selected from "Two rollers-one shoe type or Two-shoe magnet chuck type".
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Multi-Head Grinder VGM5
High precision and high speed grinding through process integration! The largest machine in the VG series.
Find out more about VGM5
One chuck for high-precision machining of inner and outer diameters and end faces. -
Hard and Brittle Wafers Grinder R631DF
Grinding of wafers (SiC, GaN, sapphire, etc.).
Allows you to store and traceability of grinding data for each wafer.
High-Precision Mirror Surface Grinder that can be replaced from lapping machines. Find out more about R631DF